IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
IEEE Transactions on Components，Packaging，and Manufacturing Technology发表了有关建模、设计、构建模块、技术基础设施和分析的研究和应用文章，这些文章支持电子、光子和MEMS封装，以及无源元件、电触点和连接器、热管理和器件可靠性的新发展;以及电子部件和组件的制造，广泛覆盖设计、工厂建模、装配方法、质量、产品稳健性和环境设计。
Stochastic Collocation With Non-Gaussian Correlated Process Variations: Theory, Algorithms, and Applications
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2889266
Defect Detection in Electronic Surfaces Using Template-Based Fourier Image Reconstruction
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2873744
Design of an Area-Scalable Two-Layer Evaporator Wick for High-Heat-Flux Vapor Chambers
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2860961
Reliability Challenges in Fabrication of Flexible Hybrid Electronics for Human Performance Monitors: A System-Level Study
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2919866
Characterization of PCB Embedded Package Materials for SiC MOSFETs
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2904533
Design, Fabrication, and Characterization of a Compact Hierarchical Manifold Microchannel Heat Sink Array for Two-Phase Cooling
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2899648
Design of Balanced Filtering Components Based on Isosceles Right-Angled Triangular Patch
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2872588
Electrical, Thermal, and Mechanical Characterization of eWLB, Fully Molded Fan-Out Package, and Fan-Out Chip Last Package
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2935477
A Wideband Resonant Cavity Antenna Assembled Using a Micromachined CPW-Fed Patch Source and a Two-Layer Metamaterial Superstrate
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2870479
Electromagnetic Characterization of the Intrachip Propagation Channel in $Ka$ - and $V$ -Bands
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2930347
Machine-Learning-Based Error Detection and Design Optimization in Signal Integrity Applications
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2916902
A Simple Simulation Approach for the Estimation of Convergence and Performance of Fully Adaptive Equalization in High-Speed Serial Interfaces
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2911177
Triple-Passband Cavity Filters With High Selectivity Under Operation of Triple Modes
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2869854
Effects of Thermal Cycling on Creep of SnAgCu Solder Joints
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2884731
A Compact Microwave Device for Fracture Diagnosis of the Human Tibia
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2893367
Process Mean of Tolerance Settings of CPU Components via CAE Simulation and Response Surface Methodology
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2879656
Analyzing Crosstalk-Induced Effects in Rough On-Chip Copper Interconnects
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2941871
Contact Resistance Model and Thermal Stability Analysis of Bolt Structure
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2877774
CFD Investigation of Airflow Management in a Small Container Data Center
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2916017
Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2926792
Wideband SIW-Based Low-Cost Multilayer Slot Antenna Array for $E$ -Band Applications
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2910385
Design of the Microstrip Bandstop Filter With High Insertion Loss
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2879898
A Comparative Study for the Junction Temperature of Green Light-Emitting Diodes
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2929172
Active Thermomechanical Stress Cancellation of Solder Joints in Surface-Mount Technology Integrated Circuits
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2870940
Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2945016
Enhancing the Structural Strength of an ODD Laptop via Six Sigma Approach
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2922728
Block Compressive Sensing for Solder Joint Images With Wavelet Packet Thresholding
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2907106
The Effect of Cable Section on the Variation of Power Automotive Connector Temperature
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2914894
Cool Interconnect: A 1024-bit Wide Bus for Chip-to-Chip Communications in 3-D Integrated Circuits
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2873298
Study on Electrical Properties of AgSnO2 Contact Materials Doped With Rare-Earth La, Ce, and Y
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2882237
Theoretical and Experimental Study on Electrical Contact Resistance of Metal Bolt Joints
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2920854
Constructive Signal Approximations for Fast Transient Simulation of Coupled Channels
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2917773
Impact of Local Stress Distribution in a Silicon Chip Mounted by Area-Arrayed Copper Pillar Wafer-Level Packaging Technology on Analog-Circuit Performance
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2901762
Assembly of Components on Inkjet-Printed Silver Structures by Soldering
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2855045
Silicon Interposer Package for MMIC Heterogeneous Integration Based on Gold/Solder Ball Flip-Chip Technique
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2917292
Multi-Material Heatsink Design Using Level-Set Topology Optimization
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2929017
Corrections to “Design and Modeling of Membrane-Based Evaporative Cooling Devices for Thermal Management of High Heat Fluxes” [Jul 16 1056-1065]
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/tcpmt.2019.2918963
Modeling Effect of Grain Orientation on Degradation in Tin-Based Solder—Part II: Electromigration Experiments
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2940566
Contour Extraction and Quality Inspection for Inner Structure of Deep Hole Components
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2873207
Through-Silicon Capacitor Interconnection for High-Frequency 3-D Microsystem
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2879977
Effective Method for Wire Bonds Rework Using Conductive Epoxy
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2878104
Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2869641
A Low-g MEMS Inertial Switch Based on Direct Contact Sensing Method
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2926332
Spreading Resistance in Flux Tubes With Variable Heat Flux and Nonuniform Convection
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2910132
Low-Loss Aerosol-Jet Printed Wideband Interconnects for Embedded Devices
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2933792
Moments-Based Parametric Sensitivity Analysis of X-Parameters
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2947588
Comparison of Wideband Interconnecting Technologies for Multigigahertz Novel Memory Architecture
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2018.2889697
Reliability-Aware 3-D Clock Distribution Network Using Memristor Ratioed Logic
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2900851
A Study on the Magnetic Dispersion of the Conductive Particles of Anchoring-Polymer-Layer Anisotropic Conductive Films and Its Fine-Pitch Interconnection Properties
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2921055
3-D Printing and CNC Machining Technologies for Exploration of Circularly Polarized Patch Antenna With Enhanced Gain
来源期刊：IEEE Transactions on Components, Packaging and Manufacturing TechnologyDOI：10.1109/TCPMT.2019.2890869
