JOURNAL OF MICROMECHANICS AND MICROENGINEERING

JOURNAL OF MICROMECHANICS AND MICROENGINEERING

J MICROMECH MICROENG
影响因子:2.1
JCR分区:Q3
新锐分区:工程技术4区
是否综述期刊:N/A
是否预警:不在预警名单内
是否OA:
出版国家/地区:ENGLAND
出版社:IOP Publishing Ltd.
发刊时间:1991
收录数据库:SCIE/Scopus收录
ISSN:0960-1317

期刊介绍

Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
微机械与微工程杂志(JMM)主要报道实验工作,但相关的建模论文也会被考虑,并得到实验数据的支持。该杂志关注以下各个方面:-纳米和微-机械系统-纳米和微-机电系统-纳米和微-机电系统-纳米和微工程-纳米和微尺度科学请注意,我们不发表与纳米或微工程没有明显应用或联系的材料论文。以下是一些包含在该杂志范围内的主题示例:-MEMS和NEMS:包括传感器、光学MEMS/NEMS、RF MEMS/NEMS等。-制造技术和制造:包括微机械加工、蚀刻、光刻、沉积、图案化、自组装、3D打印、喷墨打印。封装和集成技术。-材料、测试和可靠性。-微流控和纳米流控:包括光流控、声流控、液滴、微反应器、芯片上的器官。芯片实验室和微纳米全分析系统。-生物医学系统和设备:包括生物MEMS、生物传感器、分析、芯片上器官、药物输送、细胞、生物界面。能源和电力:包括电力MEMS/NEMS、能量采集器、执行器、微电池。电子:包括柔性电子、可穿戴电子、接口电子。光学系统。机器人学。
年发文量 128
国人发稿量 39.68
国人发文占比 0.31%
自引率 4.8%
平均录取率较易
平均审稿周期 约2.8个月
版面费 -
偏重研究方向 工程技术-材料科学:综合

期刊高被引文献

Rapid and inexpensive method for fabrication of multi-material multi-layer microfluidic devices
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AAF25A
Characterization of polymer-based piezoelectric micromachined ultrasound transducers for short-range gesture recognition applications
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB1F41
Piezoresistive strain sensor based on monolayer molybdenum disulfide continuous film deposited by chemical vapor deposition
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB0726
Fabrication of micro-scale radiation shielding structures using tungsten nanoink through electrohydrodynamic inkjet printing
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB3B26
Sensing strategies in wearable bio-mechanical systems for medicine and sport: a review
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB2F24
Effect of circuit phase delay on bias stability of MEMS gyroscope under force rebalance detection and self-compensation method
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB27E8
Hydrodynamic channeling as a controlled flow reversal mechanism for bidirectional AC electroosmotic pumping using glassy carbon microelectrode arrays
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB1D9F
Development of an impedance-based interdigitated biochemical sensor using a multiuser silicon process
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB078F
Electrical surface charge patterns induced by droplets sliding over polymer and photoresist surfaces
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB3182
On-ratio PDMS bonding for multilayer microfluidic device fabrication
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB341E
Experimental study on micromilling of thin walls
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AAEECB
A novel capacitive micro-accelerometer made of steel using micro wire electrical discharge machining method
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB4E41
Acoustic power transfer for biomedical implants using piezoelectric receivers: effects of misalignment and misorientation
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB257F
Highly sensitive and flexible strain sensor based on Au thin film
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AAEBE4
MEMS thermal gas flow sensor with self-test function
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/ab4aef
Multimode excitations for complex multifunctional logic device
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/ab4dfc
High-yield indium-based wafer bonding for large-area multi-pixel optoelectronic probes for neuroscientific research
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB2A53
Metallized SU-8 thin film patterns on stretchable PDMS
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB307F
In situ thermo-mechanical bending behavior of VO2 microcantilevers across the phase transition
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AAEAB5
Making thick photoresist SU-8 flat on small substrates
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AAED1C
Deposited poly-Si as on-demand linewidth compensator for on-chip Fabry–Perot interferometer and vertical linear variable optical filter bandpass and passband manipulation
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB035C
A bionic micro-electromechanical system piezo-resistive vector hydrophone that suppresses vibration noise
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB3DD1
Ultrasonic welding for the rapid integration of fluidic connectors into microfluidic chips
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB10D2
Fabrication of Fabry–Perot-cavity-based monolithic full-color filter arrays using a template-confined micro-reflow process
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AAF6CB
Droplet-jet mode near-field electrospinning for controlled helix patterns with sub-10 µm coiling diameter
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB025E
Vibrational modes in MEMS resonators
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/ab4bad
A novel impedance sensing approach for precise electromechanical characterization of cells
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB38FC
Numerical analysis and experiment of high-efficiency long-term PDMS open-surface mixing chip
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB145F
Intrinsic stress-induced bending as a platform technology for controlled self-assembly of high-Q on-chip RF inductors
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB16BD
Microfluidic device for generating regionalized concentration gradients under a stable and uniform fluid microenvironment
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AAF029
Fabrication of ultrahigh-aspect-ratio and periodic silicon nanopillar arrays using dislocation lithography and deep reactive-ion etching
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB3749
Theoretical and experimental studies of electrostatic focusing for electrohydrodynamic jet printing
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB0C65
Capacitive micromachined ultrasonic transducers for transmitting and receiving ultrasound in air
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/ab4e00
Uniformity improvement of deep silicon cavities fabricated by plasma etching with 12 inch wafer level
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB3602
Flow-induced synthesis of polystyrene-block-poly(ethylene glycol) vesicles on the interface of a laminated microflow
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB0237
Investigation of parallel-connected MEMS electrostatic energy harvesters for enhancing output power over a wide frequency range
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB284D
Comparison of Al and Cu masks used for patterning boron-doped diamonds in oxygen plasma
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/ab4d6f
A CMUT-based gas density sensor with high sensitivity
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB3BFA
Step and scanning lithography for patterning seamless microstructures on the inner surface of a hollow roller
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB38F1
Micromechanical vibration absorber for frequency stability improvement of DETF oscillator
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB0364
Experimental study of current density in copper filling process within deep Through-Silicon Vias with high aspect ratio
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/ab3f3e
A 37-actuator polyimide deformable mirror with electrostatic actuation for adaptive optics microscopy
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB2370
Array of 3D permanent micromagnet for immunomagnetic separation
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB259F
Dynamics of a Pair of Ellipsoidal Microparticles under a Uniform Magnetic Field
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB3432
Investigation on gate dielectric material using different optimization techniques in carbon nanotube field effect transistors (CNFETs)
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB2A61
A factorial design approach to fracture pressure tests of microfluidic BF33 and D263T glass chips with side-port capillary connections
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AAFE5B
A simple edge-following scanning algorithm for proton beam writing and other direct-write lithographies
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AAFA03
Fabrication of high aspect ratio structures in silicon independent of crystal orientation using metal assisted etching
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB1982
Millipixel image correlation for sub nm measurement of MEMS motion
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/ab3ede
High temperature-assisted electrohydrodynamic jet printing of sintered type nano silver ink on a heated substrate
来源期刊:Journal of Micromechanics and MicroengineeringDOI:10.1088/1361-6439/AB0739

质量指标占比

研究类文章占比 OA被引用占比 撤稿占比 出版后修正文章占比
92.97%41.25%--

相关指数

影响因子
影响因子
年发文量
自引率

预警情况

查看说明
时间 预警情况
2026年03月发布的新锐学术版不在预警名单中
2025年03月发布的2025版不在预警名单中
2024年02月发布的2024版不在预警名单中
2023年01月发布的2023版不在预警名单中
2021年12月发布的2021版不在预警名单中
2020年12月发布的2020版不在预警名单中
*来源:中科院《 国际期刊预警名单》

JCR分区

WOS分区等级:3区
版本 按学科 分区
WOS期刊SCI分区
WOS期刊SCI分区
WOS期刊SCI分区是指SCI官方(Web of Science)为每个学科内的期刊按照IF数值排 序,将期刊按照四等分的方法划分的Q1-Q4等级,Q1代表质量最高,即常说的1区期刊。
(2024-2025年最新版)
ENGINEERING, ELECTRICAL & ELECTRONIC
Q3
INSTRUMENTS & INSTRUMENTATION
Q3
NANOSCIENCE & NANOTECHNOLOGY
Q4
PHYSICS, APPLIED
Q3

中科院分区

查看说明
版本 大类学科 小类学科 Top期刊 综述期刊
2026年3月发布
(新锐分区)
工程技术4区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
4区
NANOSCIENCE & NANOTECHNOLOGY 纳米科技
4区
INSTRUMENTS & INSTRUMENTATION 仪器仪表
4区
PHYSICS, APPLIED 物理:应用
4区
N/A
2025年3月升级版
工程技术4区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
4区
INSTRUMENTS & INSTRUMENTATION 仪器仪表
4区
NANOSCIENCE & NANOTECHNOLOGY 纳米科技
4区
PHYSICS, APPLIED 物理:应用
4区
2023年12月旧的升级版
工程技术4区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
4区
INSTRUMENTS & INSTRUMENTATION 仪器仪表
4区
NANOSCIENCE & NANOTECHNOLOGY 纳米科技
4区
PHYSICS, APPLIED 物理:应用
4区

CiteScore

查看说明
CiteScore SJR SNIP 学科 分区 排名
5.00
0.496
0.856
大类:Engineering 小类:Mechanical Engineering
大类:Engineering 小类:Electrical and Electronic Engineering
大类:Engineering 小类:Mechanics of Materials
大类:Engineering 小类:Electronic, Optical and Magnetic Materials
Q2
Q2
Q2
Q2
202 / 720
292 / 970
134 / 403
110 / 305

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