The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.
IEEE半导体制造会刊解决了制造复杂微电子元件，特别是超大规模集成电路（VLSI）的挑战性问题。制造这些产品需要精确的微图案化、精确控制材料特性、超洁净的工作环境以及化学、物理、电气和机械工艺的复杂相互作用。
Convolutional Neural Network for Wafer Surface Defect Classification and the Detection of Unknown Defect Class
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2902657
A Voting Ensemble Classifier for Wafer Map Defect Patterns Identification in Semiconductor Manufacturing
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2904306
AdaBalGAN: An Improved Generative Adversarial Network With Imbalanced Learning for Wafer Defective Pattern Recognition
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2925361
A Novel DBSCAN-Based Defect Pattern Detection and Classification Framework for Wafer Bin Map
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2916835
Improved Normalized Cross-Correlation for Defect Detection in Printed-Circuit Boards
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2911062
Fault Detection Strategy Based on Weighted Distance of $k$ Nearest Neighbors for Semiconductor Manufacturing Processes
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2018.2857818
Nanoscale Metrology of Line Patterns on Semiconductor by Continuous Wave Terahertz Multispectral Reconstructive 3-D Imaging Overcoming the Abbe Diffraction Limit
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2018.2865167
Enhanced Stacked Denoising Autoencoder-Based Feature Learning for Recognition of Wafer Map Defects
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2940334
Feature Extraction From Analog Wafermaps: A Comparison of Classical Image Processing and a Deep Generative Model
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2911061
Wafer Defect Pattern Recognition and Analysis Based on Convolutional Neural Network
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2937793
Denoised Residual Trace Analysis for Monitoring Semiconductor Process Faults
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2916374
The Design and Implementation of an Embedded Real-Time Automated IC Marking Inspection System
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2018.2875920
Development of Novel Solar Cell Micro Crack Detection Technique
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2921951
CMOS-Compatible MESFETs for High Power RF Integrated Circuits
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2018.2867449
Statistical Process Control for Monitoring the Particles With Excess Zero Counts in Semiconductor Manufacturing
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2018.2882862
A Wafer Map Yield Prediction Based on Machine Learning for Productivity Enhancement
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2945482
A Condition Change Detection Method for Solar Conversion Efficiency in Solar Cell Manufacturing Processes
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2018.2875011
A 0.18- $\\mu$ m LDMOS With Excellent Ronsp and Uniformity by Optimized Manufacture Process
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2018.2879215
A Novel Method for Deposit Accumulation Assessment in Dry Etching Chamber
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2904889
Sub-Resolution Assist Feature Cleanup Based on Grayscale Map
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2928878
Strategies for Reducing Particle Defects in Ti and TiN Thin-Film Deposition Processes
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2018.2876463
Mechanism and Control Technique of Wafer Warpage in Process Integration for Trench Field Plate Power MOSFET
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2937391
Displaying Data Effectively Using an Automated Process Dashboard
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2938157
Advanced Process Control Using Virtual Metrology to Cope With Etcher Condition Change
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2938546
Marker Layout for Optimizing the Overlay Alignment in a Photolithography Process
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2907790
Modeling Spin Coating Over Topography and Uniformity Improvements Through Fill Patterns for Advanced Packaging Technologies
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2018.2870712
Virtual Metrology Model Robustness Against Chamber Condition Variation Using Deep Learning
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2931328
Reduced Contact Resistance in GaN Using Selective Area Si Ion Implantation
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2932272
Novel Volatile Film for the Protection of Organo-Silicate Glass Dielectric Materials
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2941323
Photoluminescence Imaging for Buried Defects Detection in Silicon: Assessment and Use-Cases
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2018.2871967
A Productivity-Oriented Wafer Map Optimization Using Yield Model Based on Machine Learning
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2018.2870253
${K}$ -Cyclic Schedules and the Worst-Case Wafer Delay in a Dual-Armed Cluster Tool
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2910399
Guest Editorial Special Section on the 2018 International Symposium on Semiconductor Manufacturing
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/tsm.2019.2945222
Research Into the LSTM Neural Network-Based Crystal Growth Process Model Identification
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2906651
Modelling and Control of Backside-Induced ESD Defects During Wet-Chemical Processes in GaAs Front End Manufacturing
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2933013
Characterization of Electroless Nickel Plated Materials During High Temperature Solder Processing
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2945517
Bessel Decomposition of Temperature Profiles in Film Deposition Reactors
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2018.2866343
Incorporating Virtual Metrology Into Failure Prediction
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2932377
The Long Journey From Standardization to Fully Fab Automation and More
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2945352
Characterization of New Method for CMP Dresser to Saving Ultrapure Water Consumption
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2891737
Gross Die Per Wafer and Yield Optimization for GaAs ICs With Sub-Micron Features
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2943399
Scribe Line Defect-Induced Yield Loss in FINFET Technology
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2942268
Spatial Correlated Data Monitoring in Semiconductor Manufacturing Using Gaussian Process Model
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2018.2883763
A Comprehensive Investigation of Depth Filter Functionality for a Colloidal Silica Slurry Used for Semiconductor Manufacturing Process
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2018.2876342
Special Section on the 2017 SEMI Advanced Semiconductor Manufacturing Conference
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2891031
Editorial 2018 Best Paper Award
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2910984
Fluid Dynamic Modeling and Flow Visualization of an Industrial Wet Chemical Process Bath
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2917083
Design and Development of InP DHBTs With High Breakdown Voltage for Ka-Band PA Applications
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2932962
In-Line Metrology for Characterization and Control of Extreme Wafer Thinning of Bonded Wafers
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2018.2885577
Modeling and Controlling Layout Dependent Variations in Semi-Additive Copper Electrochemical Plating
来源期刊：IEEE Transactions on Semiconductor ManufacturingDOI：10.1109/TSM.2019.2941439
